Display device and method for manufacturing the same

ABSTRACT

A display device includes a display module, a first adhesive member including a thermal initiator and directly disposed on a rear surface of the display module, a sensor unit directly disposed on the first adhesive member, and a second adhesive member including a photoinitiator and directly disposed on at least a portion of the first adhesive member and the rear surface of the display module.

This application is a continuation of U.S. patent application Ser. No.16/376,388, filed on Apr. 5, 2019, which claims priority to KoreanPatent Application No. 10-2018-0066335, filed on Jun. 8, 2018, and allthe benefits accruing therefrom under 35 U.S.C. § 119, the content ofwhich in its entirety is herein incorporated by reference.

BACKGROUND 1. Field

Exemplary embodiments of the invention herein relate to a displaydevice, and more particularly, to a display device and a method formanufacturing the same.

2. Description of the Related Art

Various display devices used in multimedia devices such as televisions,portable phones, tablet computers, navigation systems, and game consoleshave been developed.

The various display devices may generally include a display panel whichdisplays an image, and an input sensing unit which senses an externalinput. The display panel may include a display area in which an image isdisplayed, and a bezel area which is disposed around the display area.Recently, a display device for reducing the bezel area and for enlargingthe display area has been developed. In this case, since the bezel areaof the display device is reduced, driving components previously disposedin the bezel area may overlap the display area. A fingerprintrecognition sensor, for example, overlapping the display area has beendeveloped.

The fingerprint recognition sensor may be adhered to a rear surface ofthe display panel by an adhesive member. The adhesive member may behardened depending on a change in temperature by external heat providedfrom the outside. The adhesive member may firmly fix the fingerprintrecognition sensor to the display panel by the external heat.

SUMMARY

To provide an external heat to an adhesive member, a display device maybe moved into a chamber for providing heat. However, the adhesive memberand a display panel may move relative to each other when the displaydevice is moved. Thus, a fingerprint recognition sensor may bemisaligned with a sensing area in which a fingerprint is recognized.

The invention may provide a display device capable of easily aligning asensor unit with a sensing area, and a method for manufacturing thesame.

In an exemplary embodiment of the invention, a display device includes adisplay module, a first adhesive member including a first thermalinitiator and directly disposed on a rear surface of the display module,a sensor unit directly disposed on the first adhesive member, and asecond adhesive member including a first photoinitiator and directlydisposed on at least a portion of the first adhesive member and the rearsurface of the display module.

In an exemplary embodiment, the first thermal initiator may be activatedby a change in temperature, and the first photoinitiator may beactivated by ultraviolet (“UV”) light.

In an exemplary embodiment, the display module may include a displayarea in which an image is displayed, and a bezel area adjacent to thedisplay area. The sensor unit may overlap the display area.

In an exemplary embodiment, an opening overlapping the sensor unit maybe defined in the first adhesive member, and the sensor unit may besurrounded by the first adhesive member in a plan view.

In an exemplary embodiment, the sensor unit may be spaced apart from therear surface of the display module by the first adhesive member.

In an exemplary embodiment, the sensor unit may include a sensoroverlapping the opening, and a package in which the sensor is disposed(e.g., mounted). The package may be directly disposed on the firstadhesive member.

In an exemplary embodiment, the sensor unit may include an optical typefingerprint recognition sensor.

In an exemplary embodiment, the first adhesive member may overlap anentirety of the sensor unit and may be directly disposed on the rearsurface of the display module and the sensor unit.

In an exemplary embodiment, the sensor unit may include an ultrasonictype fingerprint recognition sensor.

In an exemplary embodiment, the first adhesive member and the secondadhesive member may constitute a single unitary body on the rear surfaceof the display module. The first adhesive member may further include asecond photoinitiator, and the second adhesive member may furtherinclude a second thermal initiator.

In an exemplary embodiment, the display device may further include acircuit board electrically connected to the display module and disposedon the rear surface of the display module. A hole area may be defined inthe circuit board, and the sensor unit may be inserted in the hole areaand may be directly disposed on the first adhesive member.

In an exemplary embodiment, the display module may include a substrate,a display element layer disposed on the substrate, an encapsulationmember disposed on the display element layer, and an input sensing unitdisposed on the encapsulation member. The first adhesive member and thesecond adhesive member may be disposed on a rear surface of thesubstrate, which corresponds to the rear surface of the display module.

In an exemplary embodiment of the invention, a display device includes adisplay module including a display area in which an image is displayed,and a bezel area adjacent to the display area, a protective memberoverlapping a portion of the display area and disposed on a rear surfaceof the display module, a sensor unit overlapping the portion of thedisplay and disposed on the protective member, and an adhesive memberoverlapping the sensor unit and adhering the sensor unit to theprotective member.

In an exemplary embodiment, a folding area and a non-folding areaadjacent to the folding area may be defined in the display module, andthe non-folding area may overlap the sensor unit. The protective membermay overlap the non-folding area.

In an exemplary embodiment of the invention, a method for manufacturinga display device includes applying a first adhesive member onto a rearsurface of a substrate in which a display area and a bezel area adjacentto the display area are defined, disposing a sensor unit on the firstadhesive member, applying a second adhesive member onto at least aportion of the first adhesive member and the rear surface of thesubstrate, irradiating UV light to the second adhesive member, andproviding external heat to the first adhesive member.

In an exemplary embodiment, the first adhesive member may include athermal initiator and may be applied onto the rear surface of thesubstrate by a first applying apparatus to overlap the display area. Thesecond adhesive member may include a photoinitiator and is applied ontothe rear surface of the substrate by a second applying apparatus tooverlap the display area.

In an exemplary embodiment, the first adhesive member and the secondadhesive member may be applied onto the rear surface of the substrate byone applying apparatus, and the first adhesive member may include afirst thermal initiator and a first photoinitiator and the secondadhesive member may include a second thermal initiator and a secondphotoinitiator.

In an exemplary embodiment, the applying of the second adhesive memberand the irradiating of the UV light may be performed at a same time.

In an exemplary embodiment, the first adhesive member may be appliedsuch that an entirety of the sensor unit overlaps the first adhesivemember.

In an exemplary embodiment, the first adhesive member may be appliedsuch that the sensor unit is surrounded by the first adhesive member ina plan view.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings are included to provide a furtherunderstanding of the invention, and are incorporated in and constitute apart of this specification. The drawings illustrate exemplaryembodiments of the invention and, together with the description, serveto explain principles of the invention. In the drawings:

FIG. 1 is a perspective view illustrating an exemplary embodiment of adisplay device according to the invention;

FIG. 2 is an exploded perspective view illustrating an exemplaryembodiment of a display device according to the invention;

FIG. 3A is a cross-sectional view illustrating an exemplary embodimentof a display module according to the invention;

FIG. 3B is a cross-sectional view illustrating another exemplaryembodiment of a display module according to the invention;

FIG. 4 is a plan view illustrating an exemplary embodiment of a displaypanel according to the invention;

FIG. 5 is an equivalent circuit diagram of a pixel illustrated in FIG.4;

FIG. 6 is a cross-sectional view taken along line I-I′ of FIG. 2;

FIG. 7 is a plan view illustrating an exemplary embodiment of a rearsurface of a display module according to the invention;

FIG. 8 is a flowchart illustrating an exemplary embodiment of a methodfor manufacturing a display device, according to the invention;

FIGS. 9A to 9D are perspective views illustrating the method formanufacturing the display device in FIG. 8;

FIG. 10A is a cross-sectional view illustrating another exemplaryembodiment of a display device according to the invention;

FIG. 10B is an exploded perspective view illustrating a sensor disposedon a rear surface of a substrate illustrated in FIG. 10A;

FIGS. 11A and 11B are perspective views illustrating another exemplaryembodiment of a method for manufacturing a display device, according tothe invention;

FIG. 12A is a plan view illustrating another exemplary embodiment of acircuit board and a display panel according to the invention;

FIG. 12B is a cross-sectional view illustrating a display deviceincluding the circuit board and the display panel of FIG. 12A;

FIG. 12C is a cross-sectional view illustrating a display deviceincluding a modified example of the circuit board and the display panelof FIG. 12A;

FIG. 13A is a plan view illustrating another exemplary embodiment of arear surface of a display device according to the invention; and

FIG. 13B is a cross-sectional view illustrating the display device ofFIG. 13A.

DETAILED DESCRIPTION

The invention now will be described more fully hereinafter withreference to the accompanying drawings, in which various exemplaryembodiments are shown. The invention may, however, be embodied in manydifferent forms, and should not be construed as limited to the exemplaryembodiments set forth herein. Rather, these exemplary embodiments areprovided so that this disclosure will be thorough and complete, and willfully convey the scopes of the invention to those skilled in the art.Like reference numerals refer to like elements throughout.

It will be understood that when an element such as a layer, region orsubstrate is referred to as being “on” another element, it can bedirectly on the other element or intervening elements may be present. Incontrast, the term “directly” means that there are no interveningelements. As used herein, the term “and/or” includes any and allcombinations of one or more of the associated listed items.

The terminology used herein is for the purpose of describing particularexemplary embodiments only and is not intended to be limiting. As usedherein, the singular forms “a,” “an,” and “the” are intended to includethe plural forms, including “at least one,” unless the content clearlyindicates otherwise. “Or” means “and/or.” As used herein, the term“and/or” includes any and all combinations of one or more of theassociated listed items. It will be further understood that the terms“comprises” and/or “comprising,” or “includes” and/or “including” whenused in this specification, specify the presence of stated features,regions, integers, steps, operations, elements, and/or components, butdo not preclude the presence or addition of one or more other features,regions, integers, steps, operations, elements, components, and/orgroups thereof.

Spatially relative terms, such as “beneath”, “below”, “lower”, “above”,“upper” and the like, may be used herein for ease of description todescribe one element or feature's relationship to another element(s) orfeature(s) as illustrated in the drawing figures. It will be understoodthat the spatially relative terms are intended to encompass differentorientations of the device in use or operation in addition to theorientation depicted in the drawing figures. For example, if the devicein the drawing figures is turned over, elements described as “below” or“beneath” other elements or features would then be oriented “above” theother elements or features. Thus, the exemplary term “below” canencompass both an orientation of above and below. The device may beotherwise oriented (rotated 90 degrees or at other orientations) and thespatially relative descriptors used herein interpreted accordingly.

It will be understood that, although the terms first, second, etc. maybe used herein to describe various elements, components, regions, layersand/or sections, these elements, components, regions, layers and/orsections should not be limited by these terms. These terms are only usedto distinguish one element, component, region, layer or section fromanother region, layer or section. Thus, a first element, component,region, layer or section discussed below could be termed a secondelement, component, region, layer or section without departing from theteachings herein.

“About” or “approximately” as used herein is inclusive of the statedvalue and means within an acceptable range of deviation for theparticular value as determined by one of ordinary skill in the art,considering the measurement in question and the error associated withmeasurement of the particular quantity (i.e., the limitations of themeasurement system).

Exemplary embodiments are described herein with reference tocross-sectional illustrations and/or plane illustrations that areidealized exemplary illustrations. In the drawings, the thicknesses oflayers and regions are exaggerated for clarity. Accordingly, variationsfrom the shapes of the illustrations as a result, for example, ofmanufacturing techniques and/or tolerances, are to be expected. Thus,exemplary embodiments should not be construed as limited to the shapesof regions illustrated herein but are to include deviations in shapesthat result, for example, from manufacturing. For example, an etchingregion illustrated as a rectangle will, typically, have rounded orcurved features. Thus, the regions illustrated in the drawing figuresare schematic in nature and their shapes are not intended to illustratethe actual shape of a region of a device and are not intended to limitthe scope of exemplary embodiments.

Hereinafter, exemplary embodiments of the invention will be described indetail with reference to the accompanying drawings.

FIG. 1 is a perspective view illustrating a display device according toan exemplary embodiment of the invention. FIG. 2 is an explodedperspective view illustrating a display device according to an exemplaryembodiment of the invention. FIG. 3A is a cross-sectional viewillustrating a display module according to an exemplary embodiment ofthe invention. FIG. 3B is a cross-sectional view illustrating a displaymodule according to another exemplary embodiment of the invention.

Referring to FIG. 1, a display device DD may display an image IM througha display surface DD-IS. In the illustrated exemplary embodiment, thedisplay device DD including a flat display surface DD-IS is illustrated.However, the invention is not limited thereto. In other exemplaryembodiments, the display device DD may include a curved display surfaceor a three-dimensional (“3D”) display surface. The 3D display surfacemay include a plurality of display areas extending in differentdirections from each other. In an exemplary embodiment, the 3D displaysurface may include a polygonal pillar-shaped display surface, forexample.

In an exemplary embodiment, the display device DD may be a flexibledisplay device. However, the invention is not limited thereto. Inanother exemplary embodiment, the display device DD may be a rigiddisplay device.

In addition, even though not shown in the drawings, electronic modules,a camera module and a power module, which are disposed (e.g., mounted)on a main board, may be disposed together with the display device DD ina bracket and/or a case to constitute a mobile phone. The display deviceDD according to the invention may be applied to large-sized electronicdevices (e.g., televisions and monitors) and small and middle-sizedelectronic devices (e.g., tablets, car navigation units, game consoles,and smart watches).

The display surface DD-IS may be parallel to a plane defined by a firstdirection DR1 and a second direction DR2. A normal direction (i.e., athickness direction of the display device DD) of the display surfaceDD-IS may be indicated by a third direction DR3. A front surface (or atop surface) and a rear surface (or a bottom surface) of each of membersor units described hereinafter may be defined by the third directionDR3. However, the first to third directions DR1, DR2 and DR3 in theillustrated exemplary embodiment are illustrated as an example of theinvention, and directions indicated by the first to third directionsDR1, DR2 and DR3 may be changed into opposite directions.

As illustrated in FIG. 1, the display surface DD-IS may include adisplay area DD-DA in which the image IM is displayed, and a bezel areaDD-NDA adjacent to the display area DD-DA. An image IM may not bedisplayed in the bezel area DD-NDA. In FIG. 1, application icons and aclock box are illustrated as an example of the image IM.

In the illustrated exemplary embodiment, the display area DD-DA may havea rectangular shape, and the bezel area DD-NDA may have a shapesurrounding the display area DD-DA in a plan view. However, theinvention is not limited thereto. The shapes of the display area DD-DAand the bezel area DD-NDA may be variously designed. In an exemplaryembodiment, the bezel area DD-NDA may be disposed adjacent to only oneside of the display area DD-DA or may be omitted, for example.

Referring to FIG. 2, the display device DD may include a window memberWM, a display module DM, a circuit board PCB, and a receiving member BC.

The window member WM may be disposed on the display module DM and maytransmit an image, provided from the display module DM, through atransmission area TA. In detail, the window member WM may include thetransmission area TA and a non-transmission area NTA. The transmissionarea TA may overlap the display area DD-DA and may have a shapecorresponding to the shape of the display area DD-DA. The image IMdisplayed in the display area DD-DA of the display device DD may bevisible to the outside through the transmission area TA of the windowmember WM.

The non-transmission area NTA may overlap the bezel area DD-NDA and mayhave a shape corresponding to the shape of the bezel area DD-NDA. Alight transmittance of the non-transmission area NTA may be less than alight transmittance of the transmission area TA. However, the inventionis not limited thereto. In another exemplary embodiment, thenon-transmission area NTA may be omitted.

In an exemplary embodiment, the window member WM may include glass,sapphire, or plastic, for example. The window member WM is a singlelayer in FIG. 2. However, the invention is not limited thereto. In analternative exemplary embodiment, the window member WM may include aplurality of layers. In an exemplary embodiment, the window member WMmay include a base layer and at least one printed layer disposed on arear surface of the base layer. The printed layer may overlap thenon-transmission area NTA. The printed layer may have a predeterminedcolor. In an exemplary embodiment, the printed layer may have a blackcolor or may have another color different from the black color, forexample.

According to an exemplary embodiment of the invention, the transmissionarea TA may include a sensing area FSA. The sensing area FSA may overlapthe transmission area TA and may be an area for recognizing afingerprint.

If the sensing area FSA overlaps only the non-transmission area NTA, anarea (or a size) of the non-transmission area NTA may be increased by anarea (or a size) of the sensing area FSA. However, the sensing area FSAmay overlap the transmission area TA (i.e., the display area DD-DA) inthe display device DD according to the exemplary embodiments of theinvention, and thus the area (or the size) of the non-transmission areaNTA may be reduced. As a result, an area (or a size) of the transmissionarea TA may be increased or enlarged.

A sensor unit overlapping the sensing area FSA may be disposed on a rearsurface of the display module DM. This will be described later indetail.

The display module DM may be disposed between the window member WM andthe receiving member BC. The display module DM may include a displaypanel DP and an input sensing unit ISU.

The display panel DP may generate an image and may provide the generatedimage to the window member WM. According to some exemplary embodimentsof the invention, the display panel DP may be, but not limited to, anorganic light emitting display panel, a liquid crystal display panel, ora quantum-dot light emitting display panel. The organic light emittingdisplay panel may include organic light emitting elements. The liquidcrystal display panel may include liquid crystal molecules. Thequantum-dot light emitting display panel may include quantum dots orquantum rods.

The case in which the display panel DP is the organic light emittingdisplay panel will be described hereinafter as an example. However, theinvention is not limited thereto. In other words, other various displaypanels may be applied to exemplary embodiments of the invention.

The input sensing unit ISU may be disposed between the window member WMand the display panel DP. The input sensing unit ISU may sense anexternal input provided from the outside. The external input may beprovided in various forms. In an exemplary embodiment, the externalinput may include at least one of various external inputs such as a part(e.g., a finger) of a body of a user, a stylus pen, light, heat, andpressure. In addition, the external input may include an approachingspatial touch (e.g., a hovering touch) as well as a touch of the part ofthe body of the user, for example.

The input sensing unit ISU may be disposed directly on the display panelDP. In the illustrated exemplary embodiment, the input sensing unit ISUmay be unitary with the display panel DP by continuous processes.However, the invention is not limited thereto. In another exemplaryembodiment, the input sensing unit ISU may be provided as a separatepanel and then may be coupled to the display panel DP by an adhesivemember.

The receiving member BC may be coupled to the window member WM. Thereceiving member BC may provide a rear surface of the display device DDand may be coupled to the window member WM to define an inner space. Thereceiving member BC may include a material having relatively highrigidity. In an exemplary embodiment, the receiving member BC mayinclude a plurality of frames and/or plates, which include glass,plastic, and/or a metal, for example. The receiving member BC may stablyprotect the components of the display device DD, which are received inthe inner space of the receiving member BC, from an external impact.

In the above description, the receiving member BC may include thematerial having the high rigidity. However, the invention is not limitedthereto. In another exemplary embodiment, the receiving member BC mayinclude a flexible material. Even though not shown in the drawings, thedisplay device DD according to certain exemplary embodiments of theinvention may be foldable or bendable. Thus, at least some componentsincluded in the display device DD may also have flexibility.

Referring to FIG. 3A, the display module DM according to an exemplaryembodiment will be described in detail. The display module DM mayinclude the display panel DP and the input sensing unit ISU describedwith reference to FIG. 2.

The display panel DP may include a substrate SUB, a circuit layer COL, adisplay element layer ED, and an encapsulation member ECL. The displaypanel DP may include a display area DP-DA and a bezel area DP-NDA. Thedisplay area DP-DA and the bezel area DP-NDA of the display panel DP mayoverlap the display area DD-DA and the bezel area DD-NDA of the displaydevice DD described with reference to FIG. 1, respectively. In certainexemplary embodiments, the bezel area DP-NDA may be adjacent to one sideof the display area DP-DA or may be omitted.

The substrate SUB may support components of the display panel DP and theinput sensing unit ISU and may include a flexible material. In anexemplary embodiment, the substrate SUB may include a plastic substrate,a glass substrate, or an organic/inorganic composite substrate, forexample. In an alternative exemplary embodiment, the substrate SUB mayhave a stack structure including a plurality of insulating layers. In anexemplary embodiment, the plastic substrate may include at least one ofan acrylic-based resin, a methacrylic-based resin, polyisoprene, avinyl-based resin, an epoxy-based resin, a urethane-based resin, acellulose-based resin, a siloxane-based resin, a polyimide-based resin,a polyamide-based resin, or a perylene-based resin, for example.

The circuit layer COL may include a plurality of insulating layers, aplurality of conductive layers, and a semiconductor layer. The pluralityof conductive layers of the circuit layer COL may include signal linesand/or a control circuit of a pixel.

The display element layer ED may overlap the display area DP-DA and maybe disposed on the substrate SUB. The display element layer ED mayinclude display elements, e.g., organic light emitting diodes. However,the invention is not limited thereto. In other exemplary embodiments,the display element layer ED may include inorganic light emitting diodesor organic-inorganic hybrid light emitting diodes, depending on a kindof the display panel DP.

The encapsulation member ECL may encapsulate the display element layerED. In an exemplary embodiment, the encapsulation member ECL may overlapthe display area DP-DA and the bezel area DP-NDA, for example. In analternative exemplary embodiment, the encapsulation member ECL mayoverlap the display area DP-DA but may not overlap the bezel areaDP-NDA.

In an exemplary embodiment, the encapsulation member ECL may be anencapsulation substrate, for example. The encapsulation member ECL mayprotect the display element layer ED from a foreign material such asmoisture, oxygen and/or dust particles. The encapsulation member ECL maybe coupled to the substrate SUB by a sealing member SLP. In an exemplaryembodiment, the sealing member SLP may include a frit, for example.However, the material of the sealing member SLP is not limited thereto.

The input sensing unit ISU may overlap the display area DP-DA and may bedisposed on the encapsulation member ECL.

In FIG. 3A, the input sensing unit ISU may be disposed directly on theencapsulation member ECL by continuous processes. However, the inventionis not limited thereto. In another exemplary embodiment, an adhesivemember (not shown) may be provided between the input sensing unit ISUand the encapsulation member ECL, and the input sensing unit ISU may bedirectly disposed on (e.g., adhered to) the encapsulation member ECL bythe adhesive member.

Referring to FIG. 3B, a display module DMa may include a display panelDPa and an input sensing unit ISUa. An encapsulation member ECLa of thedisplay module DMa of FIG. 3B may be different from the encapsulationmember ECL of the display module DM of FIG. 3A, and the other componentsof the display module DMa of FIG. 3B may be substantially the same asthe other components of the display module DM of FIG. 3A, respectively.

The display panel DPa may include the substrate SUB, the circuit layerCOL, the display element layer ED, and the encapsulation member ECLa.

The encapsulation member ECLa may encapsulate the display element layerED. In an exemplary embodiment, the encapsulation member ECLa mayoverlap the display area DP-DA and the bezel area DP-NDA, for example.In an alternative exemplary embodiment, the encapsulation member ECLamay overlap the display area DP-DA but may not overlap the bezel areaDP-NDA. The encapsulation member ECLa may include at least oneinsulating layer. In an exemplary embodiment, the encapsulation memberECLa may include at least one encapsulation organic layer and at leastone encapsulation inorganic layer.

The encapsulation inorganic layer may protect the display element layerED from moisture/oxygen, and the encapsulation organic layer may protectthe display element layer ED from a foreign material such as dustparticles. In an exemplary embodiment, the encapsulation inorganic layermay include at least one of, but not limited to, a silicon nitridelayer, a silicon oxynitride layer, a silicon oxide layer, a titaniumoxide layer, or an aluminum oxide layer, for example. In an exemplaryembodiment, the encapsulation organic layer may include, but not limitedto, an acrylic-based organic layer, for example.

The input sensing unit ISUa may be disposed directly on theencapsulation member ECLa by continuous processes. In an alternativeexemplary embodiment, the input sensing unit ISUa may be coupled to theencapsulation member ECLa by an adhesive member. In this case, the inputsensing unit ISUa may include a base layer and a sensing circuit layer.The sensing circuit layer may include a plurality of insulating layersand a plurality of conductive layers.

FIG. 4 is a plan view illustrating a display panel according to anexemplary embodiment of the invention. FIG. 5 is an equivalent circuitdiagram of a pixel illustrated in FIG. 4.

Referring to FIG. 4, the display panel DP may include a driving circuitGDC, a plurality of signal lines SGL, a plurality of first pads PD1disposed in a first bonding area SPD, and a plurality of pixels PX.

The pixels PX may be disposed in the display area DP-DA. Each of thepixels PX may include an organic light emitting diode and a pixeldriving circuit connected to the organic light emitting diode. Thedriving circuit GDC, the signal lines SGL, the first pads PD1 and thepixel driving circuit may be included in the circuit layer COLillustrated in FIG. 3A.

The driving circuit GDC may be a scan driving circuit. The drivingcircuit GDC may generate a plurality of scan signals and maysequentially output the scan signals to a plurality of scan lines GL tobe described below. The driving circuit GDC may further output othercontrol signals to the pixel driving circuits of the pixels PX.

The driving circuit GDC may include a plurality of thin film transistorsprovided by the same process (e.g., a low-temperature polycrystallinesilicon (“LTPS”) process or a low-temperature polycrystalline oxide(“LTPO”) process) as that providing the pixel driving circuits of thepixels PX.

The signal lines SGL may be disposed on the substrate SUB. The signallines SGL may include scan lines GL, data lines DL, a power line PL, anda control signal line CSL. Each of the scan lines GL may be connected tocorresponding ones of the pixels PX, and each of the data lines DL maybe connected to corresponding ones of the pixels PX. The power line PLmay be connected to the pixels PX. The control signal line CSL mayprovide control signals to the driving circuit GDC.

The signal lines SGL may overlap the display area DP-DA and the bezelarea DP-NDA. Each of the signal lines SGL may include a pad portion anda line portion. The line portion may overlap the display area DP-DA andthe bezel area DP-NDA. The pad portion may be connected to an end of theline portion. The pad portion may be disposed in the bezel area DP-NDAand may correspond to each of the first pads PD1 disposed in the firstbonding area SPD.

The circuit board PCB may be connected to the display panel DP and mayinclude a plurality of second pads PD2 disposed in a second bonding areaDPD. The second pads PD2 may be electrically bonded to the first padsPD1 disposed in the first bonding area SPD of the display panel DP, andthus a plurality of driving signals may be transmitted to the displaypanel DP through the first and second pads PD1 and PD2. The circuitboard PCB may be rigid or flexible. In an exemplary embodiment, when thecircuit board PCB is flexible, a flexible printed circuit board may beused as the circuit board PCB, for example.

The circuit board PCB and the display panel DP separated from each otherare illustrated in FIG. 4 for the purpose of ease and convenience indescription. However, a portion of the circuit board PCB may beconnected to a portion of the bezel area DP-NDA of the display panel DP,and the circuit board PCB may overlap the display area DP-DA and thebezel area DP-NDA. In an exemplary embodiment, as illustrated in FIG. 2,the circuit board PCB may be bent along one side surface of thesubstrate SUB so as to be disposed on a rear surface of the displaypanel DP, for example.

In this case, the circuit board PCB may overlap the sensing area FSA ina plan view or may not overlap the sensing area FSA in a plan view.

FIG. 5 illustrates one scan line GL, one data line DL, the power linePL, and the pixel PX connected to the lines GL, DL and PL. However, theconfiguration of the pixel PX is not limited to FIG. 5 but may bevariously modified.

The pixel PX may include the organic light emitting diode OLED and thepixel driving circuit.

The organic light emitting diode OLED may be a front surface lightemitting type diode or a rear surface light emitting type diode. Thepixel PX may include a first transistor (or a switching transistor) T1,a second transistor (or a driving transistor) T2 and a capacitor Cstwhich constitute the pixel driving circuit for driving the organic lightemitting diode OLED. A first power source voltage ELVDD may be providedto the second transistor T2, and a second power source voltage ELVSS maybe provided to the organic light emitting diode OLED. The second powersource voltage ELVSS may be lower than the first power source voltageELVDD.

The first transistor T1 may output a data signal, applied to the dataline DL, in response to a scan signal applied to the scan line GL. Thecapacitor Cst may be charged with a voltage corresponding to the datasignal received from the first transistor T1. The second transistor T2may be connected to the organic light emitting diode OLED. The secondtransistor T2 may control a driving current flowing through the organiclight emitting diode OLED in response to the amount of charges stored inthe capacitor Cst.

The equivalent circuit is illustrated as an example of the pixel PX, andthe invention is not limited thereto. In other exemplary embodiments,the pixel PX may further include a plurality of transistors and/or mayinclude two or more capacitors. In still other exemplary embodiments,the organic light emitting diode OLED may be connected between the powerline PL and the second transistor T2.

FIG. 6 is a cross-sectional view taken along line I-I′ of FIG. 2. FIG. 7is a plan view illustrating a rear surface of a display module accordingto an exemplary embodiment of the invention.

A display device DD illustrated in FIG. 6 may further include apolarizing layer POL, a window adhesive member AM, a sensor unit SU, andan adhesive member AU, as compared with the display device DDillustrated in FIG. 2.

The polarizing layer POL may be disposed between the display module DMand the window member WM. The polarizing layer POL may polarize externallight incident through the window member WM, and thus it is possible toprevent circuit elements included in the display module DM from beingvisible to the outside. In certain exemplary embodiments, the polarizinglayer POL may be omitted. The window adhesive member AM may be disposedbetween the polarizing layer POL and the window member WM to adhere thewindow member WM to the polarizing layer POL. In an exemplaryembodiment, the window adhesive member AM may include an optically clearadhesive film, an optically clear resin, or a pressure sensitiveadhesive film, for example.

As described above with reference to FIG. 2, the sensing area FSA forrecognizing an external fingerprint may overlap the display area DP-DA.However, the invention is not limited thereto. In another exemplaryembodiment, a portion of the sensing area FSA may overlap the bezel areaDP-NDA.

The sensor unit SU may overlap the sensing area FSA and may be disposedon a rear surface of the substrate SUB. The sensor unit SU may include asensor SS and a package SP in which the sensor SS is disposed (e.g.,mounted).

According to some exemplary embodiments of the invention, the sensor SSmay be a fingerprint recognition sensor and may operate in an opticaltype, an ultrasonic type, or a capacitive type, for example. However,the invention is not limited to the exemplary embodiment in which thesensor SS is the fingerprint recognition sensor. In other exemplaryembodiments, the sensor SS may include a camera, a pressure sensitivesensor, a proximity sensor, a brightness sensor, and/or a temperaturesensor, for example, disposed under the substrate SUB.

Hereinafter, the optical type fingerprint recognition sensor will bedescribed as an example of the sensor SS of the sensor unit SU accordingto the exemplary embodiment illustrated in FIG. 6. The optical typefingerprint recognition sensor may irradiate light to a fingerprint andthen may sense light reflected by the fingerprint to recognize thefingerprint.

The sensing area FSA may include a recognition area IA and a bondingarea BA surrounding the recognition area IA in a plan view. The sensorSS may overlap the recognition area IA for recognizing a fingerprint,and the package SP may overlap the recognition area IA and the bondingarea BA. In other words, the package SP may overlap the entirety of thesensing area FSA.

The sensor SS facing the substrate SUB may be disposed (e.g., mounted)in the package SP, and the package SP may transfer a signal sensed fromthe sensor SS to the circuit board PCB. Even though not shown in thedrawings, the package SP may include a control circuit electricallyconnected to the circuit board PCB and the sensor SS.

The adhesive member AU may adhere the sensor unit SU to the substrateSUB. The adhesive member AU may include a first adhesive member ADm anda second adhesive member ADa.

The first adhesive member ADm may be disposed on the rear surface of thesubstrate SUB and, more particularly, may be disposed between thepackage SP and the substrate SUB. The first adhesive member ADm may notoverlap the recognition area IA but may overlap the bonding area BA.

The first adhesive member ADm may be disposed on the rear surface of thesubstrate SUB to surround the sensor SS in a plan view. Thus, an openingOP may be defined between the substrate SUB and the sensor unit SUdisposed on the first adhesive member ADm. The sensor SS may receivelight, reflected from a fingerprint, through the opening OP defined bythe first adhesive member ADm.

According to an exemplary embodiment of the invention, the firstadhesive member ADm may include a thermal initiator that is activatedunder a condition that heat is provided. The thermal initiator of thefirst adhesive member ADm may be activated depending on a change intemperature by heat provided from the outside. A kind of the thermalinitiator may be changed depending on a temperature of heat provided ina process of manufacturing the display device DD and/or a process timeof a high-temperature process.

Thus, after the first adhesive member ADm is disposed between thepackage SP and the substrate SUB, heat may be provided from the outsideto the first adhesive member ADm. As a result, the first adhesive memberADm may be hardened by the external heat, and the package SP and thesubstrate SUB may be fixed to each other by the first adhesive memberADm.

In an exemplary embodiment, the thermal initiator included in the firstadhesive member ADm may include at least one of tert-amylperoxybenzoate, 4,4′-azobis(4-cyanopentanoic acid),1,1′-azobis(cyanocyclohexane), azobisisobutylronitirile (“AIBN”),2,2-bis(tert-butylperoxy)butane, 1,1-bis(tert-butylperoxy)cyclohexane,benzoyl peroxide (“BPO”), 2,5-bis(tert-butylperoxy)-2,5-dimethylhexane,bis[1-(tert-butylperoxy)-1-methyl ethyl]benzene,1,1-bis(tert-butylperoxy)-3,3,5-trimethylcyclohexane, tert-butylhydroperoxide, tert-butyl peracetate, tert-butyl peroxide, tert-butylperoxybenzoate, tert-butylperoxy isopropyl carbonate, cumenehydroperoxide, cyclohexanone peroxide, dicumyl peroxide, dodecanoylperoxide, 2,4-pentanedione peroxide, or potassium peroxodisulfate, forexample.

To harden the first adhesive member ADm disposed between the package SPand the substrate SUB, the display device DD may be moved into a chamberor apparatus for providing heat. However, when the heat is not providedto the first adhesive member ADm, the first adhesive member ADm and thesubstrate SUB may not be firmly fixed to each other. As a result, thefirst adhesive member ADm and the substrate SUB may move relative toeach other, and thus the first adhesive member ADm may not be accuratelyaligned with the sensing area FSA.

However, according to the exemplary embodiment of the invention, thesecond adhesive member ADa may adhere the first adhesive member ADm tothe substrate SUB. The second adhesive member ADa according to anexemplary embodiment of the invention may include a photoinitiator thatis activated by ultraviolet (“UV”) light.

In particular, the second adhesive member ADa may be disposed on atleast a portion of the first adhesive member ADm and the substrate SUB,and the UV light may be irradiated from the outside to the secondadhesive member ADa. The second adhesive member ADa may be hardened bythe irradiation of the UV light, and thus the first adhesive member ADmand the substrate SUB may be fixed to each other by the second adhesivemember ADa. In particular, the second adhesive member ADa may notoverlap the sensor unit SU and may be directly disposed on (e.g.,adhered to) at least a portion of the first adhesive member ADm and thesubstrate SUB.

As a result, the first adhesive member ADm may be fixed to the substrateSUB through the second adhesive member ADa hardened by the UV light, andthus the first adhesive member ADm may be accurately aligned with thesensing area FSA.

External UV light may not be irradiated to the first adhesive member ADmbetween the substrate SUB and the package SP which overlap the sensingarea FSA. This may be because the UV light is reflected by the sensorunit SU of a metal material. Thus, the first adhesive member ADmaccording to the exemplary embodiment of the invention may include thethermal initiator and may be hardened by a thermal treatment process.

In an exemplary embodiment, the photoinitiator included in the secondadhesive member ADa may include at least one of2,2-dimethoxy-1,2-diphenylethan-1-one,1-hydroxy-cyclohexyl-phenyl-ketone,2-hydroxy-2-methyl-1-phenyl-1-propanone,2-hydroxy-1-[4-(2-hydroxyethoxy)phenyl]-2-methyl-1-propanone,2-hydroxy-1-{4-[4-(2-hydroxy-2-methyl-propionyl)-benzyl]-phenyl}-2-methylpropan-1-one,2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropan-1-one,2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1,2-dimethylamino-2-(4-methyl-benzyl)-1-(4-morpholin-4-yl-phenyl)-butan-1-one,2,4,6-trimethylbenzoyl-diphenylphosphine oxide,2,4,6-trimethylbenzoyl-diphenyl phosphinate,bis(2,4,6-trimethylbenzoyl)-phenylphosphineoxide,[1-(4-phenylsulfanylbenzoyl)heptylideneamino]benzoate,[1-[9-ethyl-6-(2-methylbenzoyl)carbazol-3-yl]ethylideneamino] acetate,or bis(2,4-cyclopentadienyl)bis[2,6-difluoro-3-(1-pyrryl)phenyl]titanium (IV), for example.

Referring to FIG. 7, the sensor unit SU, the adhesive member AU and thecircuit board PCB may be disposed on the rear surface SUB-BS of thesubstrate SUB.

The sensor SS of the sensor unit SU may be disposed (e.g., mounted) inthe package SP to face the rear surface SUB-BS. The first adhesivemember ADm may surround the sensor SS on the rear surface SUB-BS in aplan view. In addition, the first adhesive member ADm may overlap aportion of the package SP in a plan view. In other words, the firstadhesive member ADm may be directly disposed on (e.g., adhered to) thepackage SP and the rear surface SUB-BS.

The second adhesive member ADa may overlap a portion of the firstadhesive member ADm and may be directly disposed on (e.g., adhered to)the first adhesive member ADm and the rear surface SUB-BS. Asillustrated in FIG. 7, the second adhesive member ADa may be disposed oneach of corners of the first adhesive member ADm. In an exemplaryembodiment, the second adhesive member ADa may be disposed at each ofvertexes of the first adhesive member ADm in a plan view. However, theinvention is not limited thereto, for example.

In another exemplary embodiment, the second adhesive member ADa maysurround the first adhesive member ADm in a plan view and may bedirectly disposed on (e.g., adhered to) the first adhesive member ADmand the rear surface SUB-BS. In other words, the second adhesive memberADa may be a member for fixing the first adhesive member ADm to thesubstrate SUB, and the shape and the material of the second adhesivemember ADa may be variously modified or changed.

The circuit board PCB may be spaced apart from the sensor unit SU in thesecond direction DR2. The circuit board PCB may be electricallyconnected to the sensor unit SU. In an exemplary embodiment, the circuitboard PCB and the sensor unit SU may be connected to each other througha flexible printed circuit board, for example.

FIG. 8 is a flowchart illustrating a method for manufacturing a displaydevice, according to an exemplary embodiment of the invention. FIGS. 9Ato 9D are perspective views illustrating the method for manufacturingthe display device in FIG. 8.

Referring to FIGS. 8 and 9A, a first adhesive member ADm may be appliedonto a rear surface SUB-BS of a substrate SUB by a first applyingapparatus ND1 (S110). According to an exemplary embodiment of theinvention, the first applying apparatus ND1 may provide or apply thefirst adhesive member ADm including the thermal initiator describedabove with reference to FIG. 6. External heat may not be provided to thefirst adhesive member ADm in the operation S110, and thus the firstadhesive member ADm may not be firmly adhered to the substrate SUB.

In addition, the first applying apparatus ND1 may apply the firstadhesive member ADm onto the rear surface SUB-BS in such a way that anopening OP is defined by the first adhesive member ADm. In theillustrated exemplary embodiment, the first adhesive member ADm has arectangular shape, for example. However, the invention is not limitedthereto. The shape of the first adhesive member ADm may be variouslymodified.

The circuit layer COL, the display element layer ED and theencapsulation member ECL which are described with reference to FIG. 3Amay be disposed on a front surface (or a top surface) SUB-US of thesubstrate SUB.

Referring to FIGS. 8 and 9B, a sensor unit SU may be disposed on thefirst adhesive member ADm (S120). The sensor unit SU may overlap atleast a portion of the first adhesive member ADm. Like the operationS110, external heat may not be provided to the first adhesive member ADmin the operation S120, and thus the first adhesive member ADm may notfirmly adhere the sensor unit SU to the substrate SUB.

Referring to FIGS. 8 and 9C, a second adhesive member ADa may be appliedonto the first adhesive member ADm and the rear surface SUB-BS by asecond applying apparatus ND2 (S130). The second adhesive member ADa mayoverlap at least a portion of the first adhesive member ADm.

According to an exemplary embodiment of the invention, the secondapplying apparatus ND2 may provide or apply the second adhesive memberADa including the photoinitiator described above with reference to FIG.6. The second adhesive member ADa may not overlap the sensor unit SU andmay be exposed to the outside from the first adhesive member ADm and thesensor unit SU.

UV light LB may be irradiated to the second adhesive member ADa (S140).The UV light LB may be irradiated by a light apparatus UD. Since thesecond adhesive member ADa is fully exposed to the outside from thefirst adhesive member ADm and the sensor unit SU, the UV light LB may beirradiated to the entirety of the second adhesive member ADa. The secondadhesive member ADa may be hardened by irradiating the UV light LB tothe second adhesive member ADa. As a result, the first adhesive memberADm may be firmly fixed to the substrate SUB by the second adhesivemember ADa.

According to an exemplary embodiment of the invention, the operationS130 and the operation S140 may be performed at the same time. In otherwords, the second adhesive member ADa may be applied onto the rearsurface SUB-BS by the second applying apparatus ND2, and at the sametime, the UV light LB may be irradiated to the second adhesive memberADa. Thus, before a thermal treatment process for providing externalheat to the first adhesive member ADm, the first adhesive member ADm andthe substrate SUB may be firmly fixed to each other by the secondadhesive member ADa.

In another exemplary embodiment, the operation S130 and the operationS140 may be performed before the operation S120.

Referring to FIGS. 8 and 9D, external heat may be provided to the firstadhesive member ADm (S150). The thermal initiator included in the firstadhesive member ADm may be activated because a temperature is changed bythe heat provided from the outside.

After the operation S140, the substrate SUB may be moved into a space inwhich a heat apparatus HD is disposed, to receive the external heat. Inthis case, since the substrate SUB and the first adhesive member ADm arefixed by the second adhesive member ADa, alignment between the substrateSUB and the first adhesive member ADm may be maintained.

The heat apparatus HD may provide heat HT to the entirety of the firstadhesive member ADm. The thermal initiator included in the firstadhesive member ADm may be activated by the heat HT, and thusadhesiveness of the first adhesive member ADm may be increased. In otherwords, since the heat HT is provided to the first adhesive member ADm,the first adhesive member ADm may be hardened.

In particular, the heat HT may be fully provided to the first adhesivemember ADm disposed between the rear surface SUB-BS and the sensor unitSU, and thus the sensor unit SU may be firmly fixed to the rear surfaceSUB-BS.

FIG. 10A is a cross-sectional view illustrating a display deviceaccording to another exemplary embodiment of the invention. FIG. 10B isan exploded perspective view illustrating a sensor disposed on a rearsurface of a substrate illustrated in FIG. 10A.

Structures of a first adhesive member ADm1 and a sensor unit SUz of adisplay device DDa of FIG. 10A may be different from those of the firstadhesive member ADm and the sensor unit SU of the display device DD ofFIG. 6, the other components of the display device DDa of FIG. 10A maybe substantially the same as corresponding components of the displaydevice DD of FIG. 6.

In detail, referring to FIGS. 10A and 10B, the sensor unit SUz mayinclude a sensor SSz and a package SPz in which the sensor SSz isdisposed (e.g., mounted). According to an exemplary embodiment of theinvention, the sensor unit SUz may be an ultrasonic type fingerprintrecognition sensor. In an exemplary embodiment, the ultrasonic typefingerprint recognition sensor may recognize a fingerprint by ultrasonicsignals emitted from a plurality of piezoelectric sensors included inthe sensor SSz, for example.

An adhesive member AUz may include the first adhesive member ADm1 and asecond adhesive member ADa1. The second adhesive member ADa1 may havethe substantially same material and structure as those of the secondadhesive member ADa illustrated in FIG. 6.

The first adhesive member ADm1 may be disposed on the rear surfaceSUB-BS of the substrate SUB. The first adhesive member ADm1 may overlapthe entirety of the sensor unit SUz, and an opening may not be definedin the first adhesive member ADm1.

Since the sensor SSz of the sensor unit SUz is the ultrasonic typefingerprint recognition sensor, the sensor unit SUz may be fully adheredto the rear surface SUB-BS of the substrate SUB by the first adhesivemember ADm1, as illustrated in FIG. 10B. In this case, a thickness ofthe first adhesive member ADm1 of FIG. 10A along the third direction DR3may be less than a thickness of the first adhesive member ADm of FIG. 6along the third direction DR3.

FIGS. 11A and 11B are perspective views illustrating a method formanufacturing a display device, according to another exemplaryembodiment of the invention.

A process of applying an adhesive member AUk onto the rear surfaceSUB-BS of the substrate SUB in a method for manufacturing a displaydevice in FIGS. 11A and 11B may be different from that in the method formanufacturing the display device in FIGS. 9A to 9D. The other processesof the manufacturing method in FIGS. 11A and 11B may be substantiallythe same as corresponding processes of the manufacturing method in FIGS.9A to 9D.

According to an exemplary embodiment of the invention, the adhesivemember AUk of FIGS. 11A and 11B may have a shape when the first andsecond adhesive members ADm and ADa of FIG. 6 constitute a singleunitary body.

In detail, referring to FIG. 11A, an applying apparatus NDk may applythe adhesive member AUk onto the rear surface SUB-BS of the substrateSUB. The applying apparatus NDk may apply the adhesive member AUk ontothe rear surface SUB-BS in such a way that the shape of the adhesivemember AUk corresponds to the merged shape of the shapes of the firstand second adhesive members ADm and ADa illustrated in FIGS. 9A and 9C.In other words, the adhesive member AUk may be applied onto the rearsurface SUB-BS by one applying apparatus NDk.

According to an exemplary embodiment of the invention, the adhesivemember AUk may include the thermal initiator and the photoinitiator. Inother words, the feature of the adhesive member AUk of FIG. 11A maycorrespond to a feature in which each of the first and second adhesivemembers ADm and ADa of FIG. 6 includes both the thermal initiator andthe photoinitiator.

As illustrated in FIG. 11B, since the photoinitiator is included in theadhesive member AUk, UV light LB may be irradiated to the adhesivemember AUk by a light apparatus UD. Thus, the adhesive member AUk may befirmly fixed to the rear surface SUB-BS. Thereafter, even though notshown in the drawings, the sensor unit SU of FIG. 6 may be disposed onthe adhesive member AUk, and external heat may be provided to theadhesive member AUk to fix the sensor unit SU to the adhesive memberAUk.

FIG. 12A is a plan view illustrating a circuit board and a display panelaccording to another exemplary embodiment of the invention. FIG. 12B isa cross-sectional view illustrating a display device including thecircuit board and the display panel of FIG. 12A. FIG. 12C is across-sectional view illustrating a display device including a modifiedexample of the circuit board and the display panel of FIG. 12A.

A structure of a circuit board PCBz and a position of the sensor unit SUin a display device DDb of FIGS. 12A and 12B may be different from thosein the display device DD of FIGS. 4 and 6, and the other components ofthe display device DDb may be substantially the same as correspondingcomponents of the display device DD.

Referring to FIGS. 12A and 12B, a hole area OP2 may be defined in thecircuit board PCBz according to an exemplary embodiment of theinvention. The second bonding area DPD of the circuit board PCBz may bedisposed on the first bonding area SPD, and the circuit board PCBz maybe bent along one side surface of the substrate SUB. Since the circuitboard PCBz is bent along the one side surface of the substrate SUB, aportion of the circuit board PCBz may be disposed on the rear surface ofthe substrate SUB. In this case, the portion of the circuit board PCBzdisposed on the rear surface of the substrate SUB may overlap the bezelarea DP-NDA and the display area DP-DA. In particular, the hole area OP2of the circuit board PCBz may overlap the sensing area FSA.

The sensor unit SU may be inserted in the hole area OP2 and may bedisposed on the rear surface of the substrate SUB. The sensor unit SUmay be electrically connected to the circuit board PCBz.

The adhesive member AU according to an exemplary embodiment of theinvention may be directly disposed on (e.g., adhered to) the sensor unitSU and the substrate SUB to fix the sensor unit SU to the substrate SUB.

Referring to FIG. 12C, a position of the sensor unit SU in a displaydevice DDc of FIG. 12C may be different from that in the display deviceDDb of FIG. 12B, and the other components of the display device DDc maybe substantially the same as corresponding components of the displaydevice DDb.

According to an exemplary embodiment of the invention, a hole area OP2of FIG. 12C may overlap the display area DP-DA and the bezel areaDP-NDA. Thus, the sensor unit SU of FIG. 12C may also overlap thedisplay area DP-DA and the bezel area DP-NDA.

FIG. 13A is a plan view illustrating a rear surface of a display deviceaccording to yet another exemplary embodiment of the invention. FIG. 13Bis a cross-sectional view illustrating the display device of FIG. 13A.

A display device DDd of FIGS. 13A and 13B may further include aprotective member PM as compared with the display device DD of FIG. 6.In addition, an adhesive member AD-Z of the display device DDd may bedifferent from the adhesive member AU of the display device DD. Theother components of the display device DDd of FIGS. 13A and 13B may besubstantially the same as corresponding components of the display deviceDD of FIG. 6.

According to an exemplary embodiment of the invention, the displaydevice DDd may be a flexible display device. In other words, the displaydevice DDd may include a folding area FA and a non-folding area NFAadjacent to the folding area FA, and the folding area FA may be bendableor foldable along a folding axis FX.

In detail, referring to FIGS. 13A and 13B, the protective member PM maybe disposed on the rear surface of the substrate SUB. In particular, theprotective member PM may be disposed on the rear surface of thesubstrate SUB to overlap the non-folding area NFA overlapping the sensorunit SU.

The adhesive member AD-Z and the circuit board PCBz may be disposed onthe protective member PM. The adhesive member AD-Z may adhere the sensorunit SU to the protective member PM. In an exemplary embodiment, theadhesive member AD-Z may have the same composition as that of theadhesive member AU illustrated in FIG. 6, for example. In an exemplaryembodiment, the adhesive member AD-Z may be provided in the form of adouble-sided adhesive tape, for example.

The adhesive member AD-Z illustrated in FIG. 13B may be in the form ofthe double-sided adhesive tape. In this case, the adhesive member AD-Zmay not include the thermal initiator and the photoinitiator and mayadhere the sensor unit SU to the protective member PM.

According to the exemplary embodiments of the invention, the sensor unitmay be disposed on the first adhesive member including the thermalinitiator, and the first adhesive member may be fixed to the rearsurface of the substrate by the second adhesive member including thephotoinitiator. In particular, since the first adhesive member and thesubstrate are fixed to each other by the second adhesive member, thealignment between the first adhesive member and the substrate may bemaintained when the substrate is moved into the chamber.

While the invention have been described with reference to exemplaryembodiments, it will be apparent to those skilled in the art thatvarious changes and modifications may be made without departing from thespirits and scopes of the invention. Therefore, it should be understoodthat the above exemplary embodiments are not limiting, but illustrative.Thus, the scopes of the invention are to be determined by the broadestpermissible interpretation of the following claims and theirequivalents, and shall not be restricted or limited by the foregoingdescription.

What is claimed is:
 1. A display device comprising: a display module; afirst adhesive member including a first thermal initiator and a firstsurface directly disposed on a rear surface of the display module; asensor unit directly disposed on a second surface of the first adhesivemember which is opposite to the first surface of the first adhesivemember; and a second adhesive member including a first photoinitiatorwhich is different from the first thermal initiator of the firstadhesive member and directly disposed on at least a portion of thesecond surface of the first adhesive member and the rear surface of thedisplay module, wherein, in a plan view, the second adhesive member isspaced apart from the sensor unit, and wherein only a portion of thesensor unit overlaps the second adhesive member.
 2. The display deviceof claim 1, wherein the first thermal initiator is activated by a changein temperature, and the first photoinitiator is activated by ultravioletlight.
 3. The display device of claim 1, wherein the display moduleincludes: a display area in which an image is displayed; and a bezelarea adjacent to the display area, and wherein the sensor unit overlapsthe display area.
 4. The display device of claim 1, wherein an openingoverlapping the sensor unit is defined in the first adhesive member, andthe sensor unit is surrounded by the first adhesive member in a planview.
 5. The display device of claim 4, wherein the sensor unit isspaced apart from the rear surface of the display module by the firstadhesive member.
 6. The display device of claim 4, wherein the sensorunit comprises: the sensor overlapping the opening; and a package inwhich the sensor is disposed, and wherein the package is directlydisposed on the first adhesive member.
 7. The display device of claim 4,wherein the sensor unit includes an optical type fingerprint recognitionsensor.
 8. The display device of claim 1, wherein the first adhesivemember overlaps an entirety of the sensor unit except for the sensor andis directly disposed on the rear surface of the display module and thesensor unit.
 9. The display device of claim 8, wherein the sensor unitincludes an ultrasonic type fingerprint recognition sensor.
 10. Thedisplay device of claim 1, wherein the first adhesive member and thesecond adhesive member constitute a single unitary body on the rearsurface of the display module, wherein the first adhesive member furtherincludes a second photoinitiator, and the second adhesive member furtherincludes a second thermal initiator.
 11. The display device of claim 1,further comprising: a circuit board electrically connected to thedisplay module and disposed on the rear surface of the display module,wherein a hole area is defined in the circuit board; and the sensor unitis inserted in the hole area and is directly disposed on the firstadhesive member.
 12. The display device of claim 1, wherein the displaymodule comprises: a substrate; a display element layer disposed on thesubstrate; an encapsulation member disposed on the display elementlayer; and an input sensing unit disposed on the encapsulation member,wherein the first adhesive member and the second adhesive member aredisposed on a rear surface of the substrate, which corresponds to therear surface of the display module.
 13. A display device comprising: adisplay module including: a display area in which an image is displayed;and a bezel area adjacent to the display area; a protective memberoverlapping a portion of the display area and disposed on a rear surfaceof the display module; a sensor unit overlapping the portion of thedisplay area and disposed on the protective member; and an adhesivemember overlapping the sensor unit and adhering the sensor unit to theprotective member.
 14. The display device of claim 13, wherein a foldingarea and a non-folding area adjacent to the folding area are defined inthe display module, and the non-folding area overlaps the sensor unit,and wherein the protective member overlaps the non-folding area.
 15. Amethod for manufacturing a display device, the method comprising:applying a first surface of a first adhesive member onto a rear surfaceof a substrate in which a display area and a bezel area adjacent to thedisplay area are defined; disposing a sensor unit on a second surface ofthe first adhesive member which is opposite to the first surface of thefirst adhesive member; applying a second adhesive member onto at least aportion of the second surface of the first adhesive member and the rearsurface of the substrate; irradiating ultraviolet light to the secondadhesive member; and providing external heat to the first adhesivemember, wherein, in a plan view, the second adhesive member is spacedapart from the sensor unit, and wherein only a portion of the sensorunit overlaps the second adhesive member.
 16. The method of claim 15,wherein the first adhesive member includes a thermal initiator and isapplied onto the rear surface of the substrate by a first applyingapparatus to overlap the display area, and wherein the second adhesivemember includes a photoinitiator and is applied onto the rear surface ofthe substrate by a second applying apparatus to overlap the displayarea.
 17. The method of claim 15, wherein the first adhesive member andthe second adhesive member are applied onto the rear surface of thesubstrate by a single applying apparatus, and wherein the first adhesivemember includes a first thermal initiator and a first photoinitiator andthe second adhesive member includes a second thermal initiator and asecond photoinitiator.
 18. The method of claim 15, wherein the applyingthe second adhesive member and the irradiating the ultraviolet light areperformed at a same time.
 19. The method of claim 18, wherein the firstadhesive member is applied such that an entirety of the sensor unitexcept for a sensing area of the sensor overlaps the first adhesivemember in the plan view.
 20. The method of claim 15, wherein the firstadhesive member is applied such that the sensor unit except for asensing area of the sensor is surrounded by the first adhesive member inthe plan view.